| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component, together with the electronic component used for the method, wherein an attitude of the electronic component is stabilized when soldering, while a solder is easily removed from a lead of the electronic component when replacing the components. SOLUTION: First, in a part insert process, a lead 11a of an electronic component 11 is inserted in a hole 15a of a substrate 15. At that time, a solder ball 12 is made to stick to a tipple end part of the lead 11a in advance, or the solder ball 12 is made to stick to the tip end part of the lead 11a after the insertion. In addition, the lead 11a is clinched slightly, or is left straight. After that, the substrate 15 together with the electronic part 11, is transported to the next soldering process along a transportation line, and a lower surface of the substrate 15 is dipped in a flow solder 17 springing from a solder dip bath 16. In short, the solder ball 12 is made to stick for stabilizing the attitude of the electronic component 11 when soldering, while the lead 11a is clinched slightly or left straight, so that a solder is easily removed from the lead 11a when a part is replaced. |
