RESISTANCE ELEMENT AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To realize a very compact structure of a resistance element including a plurality of individual partial resistors, by causing a bonding surface to partially overlap a resistance layer. SOLUTION: A resistance element has a support portion of a very thin ceramic plate 10. Resistance layers 20 arranged adjacent to one another other are printed on the plate 10. The number and arrangement of resistance layers 20 are determined by the resistance value to be printed and the dimension of the ceramic plate 10. On the opposite sides of the resistance elements 20, a bonding surface 30 made of gold or aluminum is vapor-deposited. The bonding surface 30 is formed to partially overlap the resistance layer 20 in an edge region 40. Then, electrical contact with the resistance layer 20 is formed. Thus, a resistance element of a very small structure including a plurality of resistance elements can be arranged on a printed wiring board.