发明名称 Wire bonding apparatus with spurious vibration suppressing structure
摘要 In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration suppressing structure for suppressing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.
申请公布号 US6779702(B2) 申请公布日期 2004.08.24
申请号 US20030350742 申请日期 2003.01.24
申请人 NEC ELECTRONICS CORPORATION 发明人 KIMURA NAOTO;MATSUKUMA HIDEMI
分类号 H01L21/60;B23K20/00;(IPC1-7):B23K1/06;B23K37/00 主分类号 H01L21/60
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