发明名称 Solder-coated articles useful for substrate attachment
摘要 A solder-coated article is described. The article comprises (1) a dielectric core having a largest dimension ranging from 1 to 1000 microns; (2) a solderable metal layer over the core; and (3) a solder layer over the metal layer. Preferably, the dielectric core is a spherical core of ceramic or glass material that ranges from 25 to 200 microns in diameter. Copper and nickel are preferred materials for the solderable metal layer. The solder is preferably selected from a solder comprising lead and tin and a solder comprising lead and indium, more preferably a 63% Sn-37% Pb solder, a 95% Pb-5% Sn solder, or a 50% Pb-50% In solder. Also described are modified substrates and (solder bonded assemblies) that can be created using such solder-coated articles, as well as a procedure for making the same.
申请公布号 US6781065(B1) 申请公布日期 2004.08.24
申请号 US20000590406 申请日期 2000.06.08
申请人 THE WHITAKER CORPORATION 发明人 PALMTEER WILLIAM JAMES
分类号 H01L21/60;H01L23/485;H01L23/498;H05K3/34;(IPC1-7):H05K1/16 主分类号 H01L21/60
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