发明名称 |
POLYAMIDE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition combinedly having excellent properties of an aromatic polyamide resin and excellent performances of molding properties, and having more excellent resistance to heat-aging and moisture resistance in comparing to usual aromatic polyamide resin compositions. SOLUTION: This polyamide resin contains (C) 0.01-1 pt.wt. of acopper compound, (D) 0.01-5 pts.wt. of an alkali metal halide compound and (E) 0.05-5 pts.wt. of an organic-based stabilizer to a total of 100 pts.wt. of (A) 95.5-50 pts.wt. of a polyamide resin composed of a dicarboxylic acid component unit comprising an aromatic dicarboxylic acid and an aliphatic dicarboxylic acid and a diamine component unit comprising an aromatic diamine and an aliphatic diamine and having 1.5-5.0 relatice viscosity measured in concentrated sulfuric acid at 20 deg.C and (B) 0.5-50 pts.wt. of a modified polyolefin.
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申请公布号 |
JP2000319508(A) |
申请公布日期 |
2000.11.21 |
申请号 |
JP19990132824 |
申请日期 |
1999.05.13 |
申请人 |
TOYOBO CO LTD |
发明人 |
HIRAMATSU TOSHIO;TAMURA TSUTOMU;YOSHIDA HIDEKAZU |
分类号 |
C08L77/06;C08K3/10;(IPC1-7):C08L77/06 |
主分类号 |
C08L77/06 |
代理机构 |
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代理人 |
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地址 |
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