| 摘要 |
PROBLEM TO BE SOLVED: To reduce a load exerted on an LSI chip junction and enhance the strength of bond between an LSI chip and a board and the strength against shearing force exerted on a supporting member. SOLUTION: An assembling system is for an electronic package assembly comprising the supporting member 100 for electronic package assembly having a plate 102 on which a cooling device is to be placed, and legs 101 which are formed on the plate and are to be inserted into holes 204 formed in the board 201; an installing plate 203 for installing the supporting member 100 for electronic package assembling on the LSI chip 202, and through holes 204 in the board 201 into which the legs 101 of the supporting member for electronic package assembling are to be inserted during installing operation. With the assembling system, the legs 101 of the supporting member for electronic package assembling are inserted into the through holes 204 in the board 201, and the supporting member for electronic package assembling is installed on the installing plate 203 by a first joining means.
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