| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that cleaning performance cannot be ensured without causing any damage to a refined pattern. SOLUTION: The substrate cleaning apparatus and the substrate cleaning method are provided with a means to oscillate an ultrasonic wave in the direction perpendicular to the flow of liquid, and a means to generate air bubbles in a cleaning liquid without transmitting the ultrasonic wave to the surface of the semiconductor substrate. Thus, the following problems can be solved: (1) the ultrasonic wave is transmitted by means of DIW (ultra pure water) or a cleaning liquid flowing on the semiconductor substrate, and the cavitation of ultrasonic wave is generated on the semiconductor substrate; (2) this action causes cracking or peeling of a refined pattern in the substrate and a pattern damage is generated; (3) when the output of ultrasonic wave is lowered to reduce an impulsive force due to cavitation, the capacity for removing particles is reduced. COPYRIGHT: (C)2005,JPO&NCIPI
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