发明名称 Multi reticle exposures
摘要 A method and file structure for exposing images from a plurality of reticles onto a wafer. Multiple images are effectively merged into the same file, which means the wafer need not be unloaded from a stage while exposing multiple reticles. For example, every odd numbered column can contain images from one reticle, and every even numbered column can contain images from a second reticle, where image shifts are used to align the patterns exactly. A continuous pattern is utilized to mimic normal wafer processing.
申请公布号 US2006127823(A1) 申请公布日期 2006.06.15
申请号 US20040011823 申请日期 2004.12.14
申请人 LSI LOGIC CORPORATION 发明人 STURTEVANT DAVID J.;DO PHONG;DEFIBAUGH DODD
分类号 G03F7/20 主分类号 G03F7/20
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