| 摘要 |
PROBLEM TO BE SOLVED: To provide an active energy ray-curable resin composition not causing warpage when curing the composition by active energy ray and a cured product having heat resistance and chemical resistance and obtained by curing the active energy ray-curable resin composition. SOLUTION: The resin composition is used for a molding method for packing an active energy ray-curable resin composition into a recessed part, curing the packed resin composition with the active energy ray and taking out the cured product from the recessed part. The resin composition comprises (A) a bifunctional urethane (meth)acrylate resin, (B) an isoboronyl (meth)acrylate and (C) a photopolymerizable initiator. The cured product is obtained by curing the resin composition. COPYRIGHT: (C)2008,JPO&INPIT |
