<p>An alignment apparatus (100) is provided with at least a table (6) which can drive a wafer (1) in directions of x axis, y axis and z axis and in a prescribed T direction; a wafer holder (2) for placing the wafer (1) on the table (6) through a work receiving plate (14) composed of a magnetic material not having a coercive force; a mask holder (4) arranged to face the wafer holder (2) for attaching a suction frame (16) whereupon the metal mask (3) is stretched; an aligning means (5) for aligning the aligning positions of the wafer (1) and the metal mask (3); and a control means (7) for controlling adhesion or separation to be easily and freely performed between the wafer (1) and the metal mask (3), by applying a direct current or an alternating current to the aligning means (5).</p>
