发明名称 SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
摘要 Provided is a substrate inspection device for inspecting a defect of a pattern formed in such a way that in a layered structure including a first layer formed on a substrate and a second layer having different composition from the first layer and formed on the first layer, the second layer is partially exposed. The substrate inspection device includes: electron emitting means for applying primary electrons onto the substrate; electron detecting means for detecting secondary electrons generated by the application of the primary electrons; data processing means for processing data on the secondary electrons detected by the electron detecting means; and voltage control means for controlling primary electron accelerating voltage. The voltage control means controls the acceleration voltage so that the primary electrons reach inside the first layer or the second layer at the portion where the second layer is exposed excluding the vicinity of the boundary between the first layer and the second layer.
申请公布号 KR20080083056(A) 申请公布日期 2008.09.12
申请号 KR20087019110 申请日期 2007.01.25
申请人 TOKYO ELECTRON LIMITED 发明人 SAITO MISAKO;HAYASHI TERUYUKI
分类号 H01L21/66;G01N23/225 主分类号 H01L21/66
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