发明名称 COPPER POWDER FOR CONDUCTIVE PASTE, AND METHOD FOR PRODUCING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide copper powder for conductive paste which is composed of mono-dispersed copper fine particles having a sharp particle distribution, including no coarse particles, having characteristics that shape is close to a true sphere or the like, and can make an electrode thin in film thickness while evading adverse influence on its electric properties, and to provide a method for stably producing the copper powder for conductive paste. <P>SOLUTION: Regarding the method for producing copper powder where a reducing agent is added to an aqueous solution comprising bivalent copper ions, so as to reduce and precipitate copper particles, in at least either a bivalent copper ion-containing aqueous solution as the aqueous solution of copper sulfate, copper nitrate or their mixture or a reducing agent containing L-ascorbic acid, D-erythorbic acid or their mixture, as a reaction promotor (nucleating agent) containing a water-soluble polymer such as polyethylene imine and methyl cellulose as a flocculation preventive, at least either Ag particles or Pd particles with the average particle diameter of 10 to 100 nm is made present. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010018880(A) 申请公布日期 2010.01.28
申请号 JP20090004661 申请日期 2009.01.13
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 FUJITA HIDEFUMI;FUJIYAMA SHUICHI;KONNO SHINICHI;HIRATA AKITSUGU;YUKI MASAYA
分类号 B22F9/24;B22F1/00;B22F1/02;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F9/24
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