发明名称 Methods and systems for forming a dual layer housing
摘要 Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.
申请公布号 US9387612(B2) 申请公布日期 2016.07.12
申请号 US201213488309 申请日期 2012.06.04
申请人 Apple Inc. 发明人 Weber Douglas;Zadesky Stephen P.;Lynch Stephen Brian
分类号 B29C45/16;B29C37/00;B29C45/14;B29K705/00;B29L31/34 主分类号 B29C45/16
代理机构 Downey Brand LLP 代理人 Downey Brand LLP
主权项 1. A method for creating an assembly that includes a substrate and a molded piece, the method comprising: adding a layer of material over the substrate such that the layer of material includes perforations through an exterior surface of the layer of material; and extruding molten material onto the exterior surface and into the perforations such that the molten material engages with binding surfaces within the perforations, wherein the molten material hardens as the molded piece secured to the substrate.
地址 Cupertino CA US