DOUBLE-SIDED PRESSURE SENSITIVE ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive tape for fixing polishing cloth, which enables polishing of even a semiconductor wafer having smooth unevenness in height and a wafer on which local differences in level are produced during a circuit forming process, thereby the differences in height on the entire surface of the wafer can be reduced evenly along the smooth unevenness in height and the differences in level.

SOLUTION: The double-sided pressure sensitive adhesive sheet comprises a soft urethane foam sheet 1 and first and second pressure sensitive adhesive compound layer 2. In the soft urethane foam sheet of the double-sided pressure sensitive adhesive sheet, the difference between the maximum thickness and the minimum thickness within an area of 1 m2is not less than 0 μm and not more than 100 μm, and the water vapor permeability is not less than 0 g/m2×24h and not more than 1000 g/m2×24h.

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