| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame having high reliability and Ag plating formed therein, which does not have the problem of plating bleeding, can sufficiently prevent Cu from being diffused, can further reduce cost, and furthermore can satisfy demand of a fine pitch by resolving plating leakage and also to provide a method of manufacturing the same.SOLUTION: In a metal plate 1 such as copper forming a lead frame base material, a NiP plating layer 2 and an Au plating layer 3 are partially formed in this order and furthermore, an Ag plating layer 4 is formed thereon. The thickness of the Nip plating layer is formed to be 0.2 μm or more, the thickness of the Au plating layer is formed to be 0.003 μm or more and the thickens of the Ag plating layer is formed to be 0.5 μm or more, and the thickness of three layers is 3 μm or less.SELECTED DRAWING: Figure 1 |
