发明名称 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
摘要 |
A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250° C.).
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申请公布号 |
US6791194(B1) |
申请公布日期 |
2004.09.14 |
申请号 |
US20000493210 |
申请日期 |
2000.01.28 |
申请人 |
HITACHI, LTD.;HITACHI CABLE, LTD. |
发明人 |
NAGAI AKIRA;EGUCHI SHUJI;OGINO MASAHIKO;SEGAWA MASANORI;ISHII TOSHIAK;TSUYUNO NOBUTAKE;KOKAKU HIROYOSHI;HATTORI RIE;MORISHIMA MAKOTO;ANJOH ICHIRO;TSUBOSAKI KUNIHIRO;MIYAZAKI CHUICHI;KITANO MAKOTO;MITA MAMORU;OKABE NORIO |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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