| 摘要 |
Provided is a high frequency module in which deformation and disconnection of internal wiring electrodes on a wiring board are decreased while improving shield characteristics between mounted components, and which can achieve size reduction. The high frequency module 1a comprises: a multilayer wiring board 2; a plurality of components 3a, 3b mounted on an upper surface 20a of the multilayer wiring board 2; a sealing resin layer 4 which is layered on the upper surface 20a of the multilayer wiring board 2, and which seals the plurality of components 3a, 3b; a shield wall 5 disposed between predetermined components 3a, 3b in the sealing resin layer 4; and an upper layer conductor 8a disposed between the upper surface 20a of the multilayer wiring board 2 and the shield wall 5 in such a manner as to overlap the shield wall 5 in a plan view of the multilayer wiring board 2, wherein the shield wall 5 has a broken-line shape including bends 5a1, 5a2 in the plan view, the shield wall 5 having protrusions 5b1, 5b2 at the bends 5a1, 5a2 penetrating through the upper layer conductor 8a. |
