发明名称 TRAY FOR PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a tray for plasma processing apparatus in which large deflection hardly occur, and conventional cooling efficiency of substrate can be maintained.SOLUTION: In a plasma processing apparatus for distributing the cooling gas from a cooling gas flow path 17 provided in a substrate mounting table 15 to a cooling gas flow path formed between the substrate mounting table 15 and a tabular tray 11 to be mounted thereon, the tray 11 includes one or a plurality of first recesses 25 formed in the surface and housing the substrate, respectively, and a second recess 28 formed on the back surface and having a bottom area larger than the area of the cooling gas flow path 17 at the output end but smaller than the bottom area of the first recess, and covering the output end of the cooling gas flow path 17 in a state where the tray 11 is mounted on the substrate mounting table 15.SELECTED DRAWING: Figure 4
申请公布号 JP2016213281(A) 申请公布日期 2016.12.15
申请号 JP20150093841 申请日期 2015.05.01
申请人 SAMCO INC 发明人 NONAKA TOMOYUKI;NODA YUKI
分类号 H01L21/683;H01L21/3065 主分类号 H01L21/683
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