| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramics circuit board which can be used for an interposer or the like, and a manufacturing method thereof.SOLUTION: A method for manufacturing a circuit board comprises the steps of: (A) obtaining pulverized powder with a raw material including primary components including Mg, Al and Si oxides, of which the contents are 10-25 mass% in terms of MgO, 15-40 mass% in terms of AlO, and 45-65 mass% in terms of SiOrespectively, and subcomponents, of which the contents are 0.1-5 mass% in terms of BO, 0.1-10 mass% in terms of CuO, 0-10 mass% in terms of MnO, and 0.1-10 mass% in terms of BiOto 100 mass% of the primary components respectively; (B) obtaining a green sheet; (C) obtaining a sheet mold with conductor paste including Ag or an Ag alloy; (D) obtaining a block laminate by laminating two or more sheet molds with conductor paste; and (E) obtaining a sintered compact by sintering the block laminate at a temperature of under 1000°C in an atmosphere of which the oxygen density is 2% or less.SELECTED DRAWING: Figure 3 |
