发明名称 Flame-resistant photo-curable resin composition.
摘要 <p>A flame-resistant, photo-curing resin comosition of the present invention consists of: (a) 35 to 65 parts by weight of an acrylic thermoplastic polymer, the acrylic thermoplastic polymer being 15 to 30% by weight copolymerized with at least one of monomer containing an alpha, beta-unsaturated carboxyl group, (b) 5 to 30 parts by weight of a bromine-substituted monomer represented by a general formula [1]: &lt;CHEM&gt; wherein R1 is H or CH3, A is &lt;CHEM&gt; wherein R2 is an alkylene group containing two or three carbon atoms, n is an integer between 1 and 4, and X1, X2, and X3 are Br or H, under a condition that at least two of the X1, X2, and X3 are Br, (c) 0 to 10 parts by weight of antimony trioxide particles with an average diameter of 0.1 mu m or smaller, (d) 20 to 50 parts by weight of a vinyl monomer, excluding component (b), and (e) 0.01 to 10 parts by weight of a photo-polymerizing initiator, wherein a total amount of the component (a), (b), (c), (d), and (e) is 100 parts by weight. o</p>
申请公布号 EP0488339(A1) 申请公布日期 1992.06.03
申请号 EP19910120465 申请日期 1991.11.29
申请人 MITSUBISHI RAYON CO., LTD 发明人 KUSHI, KENJI;INUKAI,KEN-ICHI
分类号 G03F7/004;C08F2/50;G03F7/027;G03F7/029;G03F7/031;G03F7/033;H01L21/027;H05K3/28 主分类号 G03F7/004
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