发明名称 METHOD OF PRODUCING A CONTACTLESS CHIP CARD OR A CONTACT/CONTACTLESS HYBRID CHIP CARD WITH IMPROVED FLATNESS
摘要 In a first stage two leaves of homogeneous thermoplastic are welded to either side of a support (30) of an antenna (32,34) and integrated circuit (40). The temperature and pressure applied cause the leaves to flow and eliminate all differences of thickness of the components. After solidification two layers of plastic material (62,64) are applied to the antenna sandwich (50) to form the body of the card
申请公布号 IL161707(D0) 申请公布日期 2004.09.27
申请号 IL20030161707 申请日期 2003.09.12
申请人 ASK S.A. 发明人
分类号 B42D15/10;B32B37/00;B32B37/02;B32B37/20;G06K19/07;G06K19/077;(IPC1-7):G06K 主分类号 B42D15/10
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