发明名称 METHOD FOR ASSEMBLING LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for assembling a light emitting device having a light emitting element and a package for sealing at least the light emitting element, by which a deposit is prevented from being formed on a light emitting part of the element while avoiding reduction of a productivity. <P>SOLUTION: In the method for assembling the light emitting device comprising the light emitting element 1 and the package 2 for accommodating at least the element 1, the package 2 has an ozone atmosphere sealed therein, and light having wavelengths of 400 nm or lower is irradiated into the sealed package 2. Active ozones generated in the package 2 collide with Si organic material. The Si organic material broken down by the collision becomes stable substances. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004273908(A) 申请公布日期 2004.09.30
申请号 JP20030064932 申请日期 2003.03.11
申请人 SONY CORP 发明人 YOSHIDA HIROSHI;TANIGUCHI TADASHI
分类号 H01L21/56;H01L21/44;H01S5/02;H01S5/022;H01S5/024;H01S5/0683;H01S5/323 主分类号 H01L21/56
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