发明名称 |
METHOD OF MANUFACTURING THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR FOR DYNAMIC RANDOM ACCESS MEMORY(DRAM) AND FERROELECTRIC RANDOM ACCESS MEMORY(FERAM) |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal-insulator-metal(MIM) capacitor provided with an insulator having a high dielectric constant or a ferroelectric interelectrode film conformable to a double damascene modus. <P>SOLUTION: A method of integrating the MIM by the double damascene modus comprises the steps of: forming a first plane insulating layer 20 and depositing an etching stop layer 22 and a second insulating layer 24; etching a capacitor node contacts opening 1 against a substrate; and etching a first recess 2 against the etching stop layer 22. A conductive layer 26 is filled in the contacts opening and the first recess by using the double damascene modus. A second recess 3 is formed around the capacitor node contacts on the second insulating layer. A first conformation metal layer 28, an interelectrode dielectric layer 30 and a second metal layer 32 are deposited and simultaneously patterned to form a capacitor upward the node contacts. The second recess increases a capacitor area, while patterning the metal layer, resulting in decreased treatment step. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004274021(A) |
申请公布日期 |
2004.09.30 |
申请号 |
JP20030339500 |
申请日期 |
2003.09.30 |
申请人 |
CHARTERED SEMICONDUCTOR MFG LTD |
发明人 |
CHENG WEI-HUA;YEN DANIEL;TAKAHASHI KUNIHIKO;LEI MING;JOY THOMAS |
分类号 |
H01L;H01L21/02;H01L21/768;H01L21/8242;H01L21/8246;H01L27/10;H01L27/105;H01L27/108;H01L27/115 |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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