DIFFUSION BONDED SPUTTERING TARGET ASSEMBLY WITH PRECIPITATION HARDENED BACKING PLATE AND METHOD OF MAKING SAME
摘要
Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
申请公布号
WO9826107(A1)
申请公布日期
1998.06.18
申请号
WO1997US23414
申请日期
1997.12.04
申请人
JOHNSON MATTHEY ELECTRONICS, INC.;BEIER, ANTHONY, F.;KARDOKUS, JANINE, K.;STROTHERS, SUSAN, D.
发明人
BEIER, ANTHONY, F.;KARDOKUS, JANINE, K.;STROTHERS, SUSAN, D.