| 摘要 |
The semiconductor chip has a circuit (2) developed in the semiconductor substrate (1), and includes a conductive screening layer (4) for protecting the circuit, at least on one side, against electric fields. A further, ferromagnetic, layer (5) is provided for protecting the circuit, at least on one side, against magnetic fields, and is preferably arranged over the surface of the semiconductor substrate supporting the circuit layer. The ferromagnetic layer (5,5a) almost completely surrounds the semiconductor chip.
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