| 摘要 |
PROBLEM TO BE SOLVED: To further improve productivity in a mounting process in connecting a semiconductor element and a circuit board via an anisotropic conductive film. SOLUTION: A semiconductor element 1 and an anisotropic film 2 are integrally jointed, and a semiconductor device is formed. The end parts of the conduction paths 21 of a film 2 are brought into contact with the respective electrodes 11 of the element 1, or they are jointed. Then, the semiconductor device where electrical connection with an outer part is realized via the film 2 is obtained. In a mounting substrate, a circuit board and the anisotropic conductive film are integrally jointed, and a bear chip can be mounted through the film. The anisotropic conductive film 2 has a structure, where plural metallic conductors 21 are installed in a film substrate 22 formed of insulating resin in a state where the conductors 21 are mutually insulated and in a state, where they pass through the film substrate in a thickness direction as the conduction paths.
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