发明名称 |
Photosensitive resin composition for far-ultraviolet exposure |
摘要 |
A photosensitive resin composition for far-ultraviolet exposure of from 170 to 220 nm, which comprises an N-hydroxymaleinimide-type sulfonate photo acid generator having a specific structure and a resin having a substituent capable of increasing the solubility to an alkali developer by an acid, and a pattern forming method using the photosensitive resin composition. The photosensitive resin composition has a high transparency to light having a wavelength of from 170 to 220 nm and is excellent in the photocomposition property and the acid generating efficiency.
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申请公布号 |
US6150068(A) |
申请公布日期 |
2000.11.21 |
申请号 |
US19970911165 |
申请日期 |
1997.08.14 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
SATO, KENICHIRO;KODAMA, KUNIHIKO;UENISHI, KAZUYA;AOAI, TOSHIAKI |
分类号 |
G03F7/004;G03F7/039;G03F7/30;H01L21/027;(IPC1-7):B03F7/004 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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