发明名称 |
Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same |
摘要 |
An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These optical fibers are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.
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申请公布号 |
US6150188(A) |
申请公布日期 |
2000.11.21 |
申请号 |
US19980031975 |
申请日期 |
1998.02.26 |
申请人 |
MICRON TECHNOLOGY INC. |
发明人 |
GEUSIC, JOSEPH E.;AHN, KIE Y.;FORBES, LEONARD |
分类号 |
G02B6/43;H01L23/48;(IPC1-7):H01L21/00 |
主分类号 |
G02B6/43 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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