发明名称 |
Double side grinding apparatus and double side polishing apparatus |
摘要 |
A double side grinding apparatus and a double side polishing apparatus, with a narrow tolerance range, reduces pitching errors, and ensures a sufficient level of rigidity against the force of reaction to machining, while enhancing positioning accuracy. The double side grinding apparatus or a double side polishing apparatus includes a plurality of guideways for supporting and shifting main spindles, and these plural guideways on end define a geometric center matched with the center of gravity of the main spindles. The number of the guideways is preferably three in order not to obstruct the mounting and removal of a workpiece.
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申请公布号 |
US6165054(A) |
申请公布日期 |
2000.12.26 |
申请号 |
US19990252083 |
申请日期 |
1999.02.18 |
申请人 |
SUPER SILICON CRYSTAL RESEARCH INSTITUTE CORP.;SUMITOMO HEAVY INDUSTRIES, LTD. |
发明人 |
ABE, KOHZO;ISOBE, SHO;TOMITA, YOSHIYUKI;HARA, KAZUTOSHI;MASAKI, RYUZO;IWASE, AKIO;NAGATA, HIROSHI |
分类号 |
B23Q1/26;B23Q1/70;B24B7/17;B24B41/02;(IPC1-7):B24B7/00 |
主分类号 |
B23Q1/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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