发明名称 |
Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier |
摘要 |
A bare chip carrier for holding a bare chip includes a bare chip carrier base member, a bump electrode which is located above a principal surface of the bare chip carrier base member and which is to be connected to a pad electrode of the bare chip, a bare chip carrier electrode which is formed on a back surface of the bare chip carrier base member and which has a recessed portion, and a wiring that connects the bump electrode to the bare chip carrier electrode. |
申请公布号 |
US2002111051(A1) |
申请公布日期 |
2002.08.15 |
申请号 |
US20010956348 |
申请日期 |
2001.09.20 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
HASHIMOTO OSAMU |
分类号 |
G01R31/26;G01R1/04;G01R1/073;H01L21/66;H01L23/32;H05K3/32;(IPC1-7):H05K1/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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