发明名称 MOVABLE CONTACT UNIT WITH BUMPS AND METHOD OF MANUFACTURING THE SAME
摘要 Disclosed is a method of efficiently bonding bump members of a small cylindrical shape punched out of a highly flexible plastic film without leaving considerable extent of cutting burrs. The method comprises steps of forming bump members 45 by carrying out a half-cut process on first substrate 56 comprising highly flexible first plastic film 51 adhered to first reinforcing film 53 of a material having rigidity higher than first plastic film 51 with adhesive layer 52, removing first plastic film 51 in a manner to leave cut-out bump members 45 on first reinforcing film 53, adhering bump members 45 to second plastic film 61 coated with adhesive 47, and securely bonding thereafter bump members 45 to second plastic film 61 by hardening adhesive 47.
申请公布号 US2009101273(A1) 申请公布日期 2009.04.23
申请号 US20080255925 申请日期 2008.10.22
申请人 PANASONIC CORPORATION 发明人 KARAKI MINORU;NUMOTO NOBUHIRO
分类号 B32B37/02 主分类号 B32B37/02
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