| 摘要 |
In a resin molding device (1), a lower mold (4) is provided with a side surface member (8) and a bottom surface member (9) capable of being raised and lowered within the side surface member (8). Substrate pressing pins (17) are disposed in the bottom surface member (9). A substrate (6) in which a through hole and a connection electrode portion are formed is fixed to an upper mold (3). By raising the lower mold (4), tip portions of the substrate pressing pins (17) are brought into intimate contact with predetermined areas where the through hole and the connection electrode portion are formed, and are pressed thereto. By raising the lower mold (4), the substrate (6) is clamped by an upper surface of the side surface member (8), and the predetermined areas are further pressed by the substrate pressing pins (17). The substrate pressing pins (17) press against a periphery of the through hole and a surface of the connection electrode portion, so it is possible to prevent fluid resin from entering the periphery of the through hole and the surface of the connection electrode unit. The state prior to resin sealing, in which the surface of the predetermined areas is exposed, can therefore be maintained, without sealant resin being formed on the predetermined areas. |
