| 摘要 |
PROBLEM TO BE SOLVED: To radiate heat of a heating component even when the heat of the heating component excesses heat radiation capability of a heat radiation part thermally connected with the heating component, for example.SOLUTION: Heat radiation parts 120a and 120b are thermally coupled with a memory 220 and a CPU 230 (a heating component) placed on a surface (a first surface) of a substrate 210. A frame 130 has thermal conductivity and is attached onto the surface of the substrate 210. An opening 131 is formed at a position corresponding to a position where the heat radiation parts 120a and 120b are provided, in the frame 130. An elastic rubber 150 has thermal conductivity and flexibility and thermally connects between the heat radiation parts 120a and 120b and the frame 130.SELECTED DRAWING: Figure 1 |
