| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing an optoelectronic semiconductor chip.SOLUTION: A method of manufacturing an optoelectronic semiconductor chip 10 consists of a step of forming a growth substrate, a step of forming a group III nitride nucleation layer on the growth substrate by sputtering, and a step of growing a group III nitride semiconductor laminate having an active layer 2a on the nucleation layer, and further includes a step of removing the growth substrate, nucleation layer, and intermediate layer. On the side of the semiconductor laminate opposite to the carrier substrate 11, a roughened surface 13 is formed.SELECTED DRAWING: Figure 4 |
