| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel electrostatic chuck device capable of enhancing the processing accuracy of a wafer.SOLUTION: An electrostatic chuck device includes a mounting table 11 provided with a mounting surface, an annular focus ring 12 surrounding the mounting surface, and cooling means for cooling the mounting table 11 and focus ring 12. The mounting table 11 has a holding part 15 provided around the mounting surface in the circumferential direction of the focus ring 12, and attracting the focus ring 12 electrostatically. The holding part 15 has a pair of banks 16 provided in the circumferential direction, and mounting the focus ring 12, and an annular groove 17 formed between the pair of banks 16. Cooling means supplies a heat-transfer gas G to the groove 17, and an electrostatic chuck device 10A is provided so that the amount of the heat-transfer gas G flowing out from the first bank 16A, out of the pair of banks 16, located on the outer peripheral side of the focus ring 12 is larger than the amount flowing out from the second bank 16B located on the inner peripheral side of the focus ring 12.SELECTED DRAWING: Figure 2 |
