发明名称 ELECTROSTATIC CHUCK AND WAFER PROCESSING DEVICE
摘要 This electrostatic chuck is characterized by comprising: a ceramic dielectric substrate, which is a polycrystalline ceramic sintered body, having a first main surface onto which an object to be processed is placed, a second main surface that is on the reverse side of the first main surface, and a seal ring that is provided to a circumferential end section and that forms part of the first main surface; and an electrode layer, which is interposed between the first main surface and the second main surface of the ceramic dielectric substrate, and which is integrally sintered with the ceramic dielectric substrate. The electrostatic chuck is further characterized in that the outer circumference of the ceramic dielectric substrate is processed such that the gap between the outer circumference of the ceramic dielectric substrate and the outer circumference of the electrode layer is uniform as seen from a direction perpendicular to the first main surface, the width of the seal ring is 0.3 to 3 millimeters inclusive, and the width by which the electrode layer overlaps the seal ring is -0.7 to 2 millimeters inclusive when seen from a direction perpendicular to the first main surface. A large and constant clamping force can be obtained at the outer circumferential part of the ceramic dielectric substrate while the outer circumference of an electrode is accurately and uniformly disposed up to a position near the outer circumference of the ceramic dielectric substrate and the withstand voltage is maintained. In addition, the temperature distribution of the object to be processed can be made uniform.
申请公布号 WO2016170694(A1) 申请公布日期 2016.10.27
申请号 WO2015JP62905 申请日期 2015.04.28
申请人 TOTO LTD. 发明人 ANADA, Kazuki;YOSHII, Yuichi;WADA, Takuma
分类号 H01L21/683 主分类号 H01L21/683
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