| 摘要 |
PROBLEM TO BE SOLVED: To reduce the area of a semiconductor device.SOLUTION: A semiconductor device includes: a first semiconductor chip having a first surface, a second surface on the opposite side to the first surface, a first electrode provided on the first surface, a second electrode provided on the second surface and a first contact electrically connecting the first electrode and the second electrode; a second semiconductor chip having a third surface disposed so as to face the first surface, a fourth surface being a surface on the opposite side to the third surface and a third electrode provided on the fourth surface; a metal wire electrically connecting the third electrode and the first electrode; a first insulating layer being disposed on the second surface of the first semiconductor chip and having a first opening; a first conductive layer being disposed at the first opening and a part on the first insulating layer and electrically connected to the second electrode in the first opening; and a first external terminal electrically connected to the first conductive layer.SELECTED DRAWING: Figure 1 |
