发明名称 Process for preventing melt-back in the production of aluminum-containing laser devices
摘要 A process for the production of semiconductor devices includes: (1) forming a thin semiconductor film containing no aluminum on a first semiconductor layer containing aluminum that is disposed on a substrate one or more (2) forming channels on said thin semiconductor film in such a manner that the channel or channels reach or go through said first semiconductor layer to expose a portion of said substrate, resulting in a channelled substrate for succeeding crystal growth thereon, and (3) producing by epitaxial growth crystalline layers on said channelled substrate by the use of a crystal growth solution having a supersaturation which is high enough to prevent said first semiconductor layer from undergoing meltback.
申请公布号 US4632709(A) 申请公布日期 1986.12.30
申请号 US19850781707 申请日期 1985.09.30
申请人 SHARP KABUSHIKI KAISHA 发明人 TANEYA, MOTOTAKA;MATSUI, SADAYOSHI;MATSUMOTO, MITSUHIRO;HAYASHI, HIROSHI
分类号 H01L21/20;H01L21/208;H01S5/00;(IPC1-7):H01L21/208 主分类号 H01L21/20
代理机构 代理人
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