发明名称 |
KERAMISCHE MEHRSCHICHTPLATTE FUER KUPFERSCHALTUNG. |
摘要 |
<p>A multilayer ceramic copper circuit board was produced by forming a multilayer structure comprising layers of copper-based paste patterns and layers of glass-ceramic. The glass-ceramic consisted of a mixture of 3% to 75% by weight of mullite, 25% to 97% by weight of borosilicate glass having a softening temperature of at least 720 DEG C, and 0% to 70% by weight of quartz glass, based on the total weight of the glass-ceramic, and blended with a binder composition containing a thermally depolymerizable resin. The multilayer structure was prefired in an inert atmosphere containing water vapor and having a partial pressure of 0.005 to 0.3 atmosphere, at a temperature at which the thermally depolymerizable resin was eliminated, the multilayer structure was then fired in an inert atmosphere containing no water vapor at a temperature below the melting temperature of copper, to sinter the glass-ceramic.</p> |
申请公布号 |
DE3768417(D1) |
申请公布日期 |
1991.04.11 |
申请号 |
DE19873768417 |
申请日期 |
1987.10.20 |
申请人 |
FUJITSU LTD., KAWASAKI, KANAGAWA, JP |
发明人 |
AOKI, SHIGENORI;IMANAKA, YOSHIHIKO, ATSUGI-SHI KANAGAWA 243, JP |
分类号 |
C03C8/16;C03C14/00;H01L21/48;H01L23/15;H05K1/00;H05K1/03;H05K3/46;(IPC1-7):H01L21/48 |
主分类号 |
C03C8/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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