发明名称 MULTILAYER WIRING BOARD
摘要 PURPOSE:To form a contact hole having little roughness by a method wherein the area of a contact hole is formed wider than a specified area of a region which connects a contact hole in such a way that its position is not superposed on that of the contact hole in the (n+1)th layer insulator layer, but on that of a contact hole in a (n+2)th layer insulator layer. CONSTITUTION:The area of a contact hole formed in an n-th layer insulator layer 3 on an n-th layer conductor layer 2 is formed in 10% or higher of that of a region, where connects with a contact hole in the layer 2, of the layer 3. A contact hole formed in a (n+1)th layer insulator layer 3 is formed in such a way that its position is not superposed on that of the contact hole formed in the layer 3. On the other hand, a contact hole formed in a (n+2)th layer insulator layer 3 is formed in such a way that one part of its position is superposed on that of the contact hole formed in the layer 3. As a result, a contact hole having little roughness can be formed in a limited area.
申请公布号 JPH0799390(A) 申请公布日期 1995.04.11
申请号 JP19930313504 申请日期 1993.12.14
申请人 TORAY IND INC 发明人 MIURA YASUO;TACHIBANA YASUKO
分类号 H05K1/05;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/05
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