| 摘要 |
<p>A device (1) for mounting and/or soldering or gluing electronic components, particularly SMD components, on printed circuit boards (4), having a first support (3) for at least one printed circuit board (4) and a second support (12,18) for the component, it being possible to adjust the second support (12,18) with respect to the first support (3) parallel to the plane of the printed circuit board (4) and transversely thereto, and having a magazine (14) for the components, is to be designed in such a way that the respective mounting location on the printed circuit board (4) can be easily found. This is achieved in that assigned to the second support (12) is a positioning device (28), with a positioning part (31) which is automatically adjustable to the mounting location parallel to the plane of the printed circuit board (4), and with a positioning element (29) on the second support (12) which can be brought into active connection with the positioning part (31) for positioning the second support (12) with respect to its movement parallel to the plane of the printed circuit board (4). …<IMAGE>… </p> |
