| 摘要 |
<p>A semiconductor laser module is described in which the vicinity of one end of optical fiber (22) is fixed to one side wall of the semiconductor laser module (20), an electronic cooling element (23) is secured to the interior bottom surface of a module package (21), and a substrate (24) composed of a metal plate having a two-level construction in which the upper-level portion (24U) and the lower-level portion (24D) have a level difference h, the upper surface of the electronic cooling element (23) being secured to the lower surface of upper-level portion (24U), a semiconductor laser (25) being secured to the end portion of the upper surface of upper-level portion (24U), and a lens (26) being mounted on the upper surface of lower-level portion (24D) of the substrate; whereby the overall height occupied by all components is reduced by the level difference has compared with a semiconductor laser module in which the lower surface of the substrate is a single plane. <IMAGE></p> |
