发明名称 Moulded circuit board preparation
摘要 Preparing a moulding containing an electrical switch comprises: (a) the preparation of a basis moulding from an active material (w.r.t. a current-free coating solution) comprising 100 pts. wt. thermoplastic olefin resin, 10-30 parts thermoplastic polyester resin and 2-10 parts active catalyst (w.r.t. the solution); (b) shaping the basis moulding into a finished article to form a surface that is coated with a material inactive w.r.t. the current-free coating solution, whilst leaving an exposed surface of active material in the basis moulding; and (c) coating the finished article without the use of an electrical current to form an electrical circuit switch on the exposed active material surface.
申请公布号 DE19726850(A1) 申请公布日期 1998.01.29
申请号 DE19971026850 申请日期 1997.06.24
申请人 YAZAKI CORP., TOKIO/TOKYO, JP 发明人 KATSUMATA, MAKOTO, GOTENBA, SHIZUOKA, JP;YAMANASHI, HIDENORI, GOTENBA, SHIZUOKA, JP;USHIJIMA, HITOSHI, GOTENBA, SHIZUOKA, JP
分类号 C23C18/16;H05K1/03;H05K3/00;H05K3/18;(IPC1-7):H05K3/02 主分类号 C23C18/16
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