发明名称 WIRE BONDING METHOD/DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent a ball formed at the tip part of wire from being hardened by quenching phenomenon until it is connected to a bonding part by supplying preheating discharge thermal energy lower than discharge heat energy for forming ball to the tip part of wire. SOLUTION: A control signal is sent from a first discharge time setting circuit 13 to a first discharge current supply circuit 15 for time T1 . The control signal is sent from a second discharge time setting circuit 14 to a second discharge current supply circuit 16 for time T1 +T2 , namely, discharge time containing ball forming time and preheating time. When discharge time T1 elapses, a discharge current automatic switch circuit 17 switches discharge current I1 to discharge current I2 . Current I2 is set to be smaller than current I1 , and preheating discharge energy which is set to be lower than discharge thermal energy for forming ball is supplied to wire 4 and an electrode 7. Since preheating discharge thermal energy is reduced with the lapse of time, the quenching phenomenon of the ball 4A can he prevented.
申请公布号 JPH10163242(A) 申请公布日期 1998.06.19
申请号 JP19960318353 申请日期 1996.11.28
申请人 POWER:KK 发明人 UENO MASAHIRO
分类号 H01L21/60 主分类号 H01L21/60
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