Bonded wafer especially silicon wafer

摘要

A bonded wafer consists of two or more wafer layers bonded together by a binder comprising an amorphous hot melt adhesive aromatic polyimide (X) layer or a sandwich of a polyimide (Y) substrate layer between two amorphous hot melt adhesive aromatic polyimide (X) layers. Also claimed are processes for producing a bonded wafer. Further claimed is a substrate obtained by subjecting a surface of the above bonded wafer to grinding, polishing and/or etching.