| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mechanism for mounting a semiconductor device onto a board, while enhancing bonding strength by preventing interlayer stripping of an interposer at a reinforced terminal part. SOLUTION: A plated through-hole 15 is made at a part of an interposer 3' to be arranged with a reinforcing terminal 10 in order to prevent interlayer stripping of the interposer 3', even if stresses are generated at the part of the reinforcing terminal 10 due to twisting or warpage of a mounting board 7 through connection with the layers of the interposer 3'. According to this structure, bonding strength is enhanced between a semiconductor device 1' and the mounting board 7, thus enhancing the reliability of the semiconductor device 1'. Furthermore, peeling test can be carried out accurately at a joint, when new parts are introduced.</p> |
