Method for fabricating a three dimensional integrated circuit for a higher system gain achievement

摘要

The method involves preparing a first substrate (1) contg. one or more preprocessed component planes (3) on a first side with independent adjacent components or circuits in several component planes forming a component stack. The components, circuits and stacks of the first substrate are functionally tested to distinguish functional ones from non-functional ones. The first substrate is connected to an auxiliary substrate (8) on the first side and then thinned or removed on the opposite side. The auxiliary substrate with the connected components is divided into individual chips, each contg. functional or non-functional components, stacks or circuits. A carrier substrate (9) is prepared and chips carrying functioning items applied adjacent to each other with some adjustment. The auxiliary substrate is then removed and at least one further component plane is applied to those on the carrier substrate.