| 摘要 |
<p>A resin film characterized in that a resin of the film comprises poly(butylene terephthalate) as a component therein, and that it has a DSC-related value of 60 or less which value is given by the following formula: a DSC-related value (°C) = Tmp-Tc2, wherein Tmp (°C) is an endothermic peak temperature in a temperature rising process as measured by DSC and Tc2(°C) is an exothermic peak temperature in a temperature falling process as measured by DSC, and a decorative metal plate which is characterized in that it is covered with the aforementioned film. A resin film for use in a construction material or the like which is required to be resistant to water, such as a unit bath, and a decorative metal plate covered with the film are also provided. The resin film of the present invention exhibits excellent embossing processability similar or superior to that of a conventional soft poly(vinyl chloride).</p> |
