| 摘要 |
PROBLEM TO BE SOLVED: To easily peel off a film which adhered at film coating. SOLUTION: First, an electronic component 2 is prepared. Then, hollow packings 8 are arranged within an opening 5a of base materials 5 and 6 to cover the inside peripheral wall of the opening 5a. Next, the electronic part 2 is arranged within the base materials 5 and 6, so that prescribed section of the electronic part 2 is exposed through the hollow of the packing 8. Then, the surface of the base materials 5 and 6 is covered with a cover 9, which is equipped with a window 9c in the position corresponding to the hollow of the packing 8, and then 9 film coating is applied to it through the hollow, thus film coating is applied to the prescribed section of the electronic component 2. Hereby, it is arranged so that the film 11 does not adhere to the base materials 5 and 6 at film coating. As a result, the film can be peeled off easily from the base materials 5 and 6 by removing the cover 9 from the base material 5 and 6, and the film coating to the electronic components 2 can be performed in order, using the same base materials 5 and 6.
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