Fabrication of electronic components having a hollow package structure with a ceramic lid

摘要

A process for fabricating an electronic component having a hollow packaging structure comprises the steps of: (a) printing an organic polymeric material on at least a portion of a main surface of a ceramic substrate where a ceramic lid is to be bonded and curing the printed organic polymeric material to form a cured product; (c) hermetic sealing the ceramic lid on a surface of the cured product with an organic bonding agent; and preferably (b) irradiating ultraviolet rays onto a surface of said cured product to form activated bonding sites between said steps (a) and (c). According to the process, a hollow package mounted with an electronic component can be fabricated efficiently.